semiconductor

Trelleborg Sealing Solutions will showcase its Isolast K-Fab Seal at SEMICON Taiwan 2022.

Trelleborg Sealing Solutions will showcase its new Isolast K-Fab Seal at SEMICON Taiwan 2022 this week (September 14-16, 2022), which provides long-term sealing and improves operational efficiency in high-temperature semiconductor sub-fab applications at the Taipei Nangang Exhibition Center in Taipei, Taiwan.

"As extreme temperatures and more and more corrosive chemical effluents are processed in semiconductor factory environments, reliable sealing solutions are essential to prevent premature failure. Isolast K-Fab seals are highly resistant to complex chemistries and extreme temperatures in critical sub-fab environments, providing an ideal alternative sealing solution for traditional O-rings," said Ethan Huang, Semiconductor Group Manager, Trelleborg Sealing Solutions. "Installation is fairly easy due to the unique design of the elastomer elements forming a puzzle-like connection with the flange insert, and Isolast K-Fab seals help extend preventive maintenance intervals and significantly reduce the cost of ownership.

Custom seal geometries formulated with perfluoroelastomer (FFKM) use significantly less rubber to eliminate spillage and extrusion, improving thermal performance and eliminating thermal expansion and groove spillage. Compared to O-rings, the seal geometry can withstand flange misalignment for easy assembly. This optimized seal design improves performance, especially under varying pressure or vacuum conditions, resulting in longer service life and lower total cost of ownership.

Isolast K-Fab seals can withstand temperatures up to 327°C/620°F, depending on material selection. The flexible use of elastomer materials aims to reduce the total cost of ownership by matching material properties to the application. Isolast K-Fab flange seals are suitable for use with aluminum or stainless steel and can be manufactured from a range of elastomer materials, including Isolast FFKM, Isolast PureFab FFKM, PureFab FKM for ultra-high purity and standard FKM.

During the three-day event, Trelleborg's technical experts will also be on hand to discuss how its Turcon Variseal NW provides cost-effective and optimal sealing in the most extreme processing applications, and how its Variseal PS provides equipment manufacturers and end users with sealing solutions compatible with virtually all chemical media. In addition, visitors to the Trelleborg booth will be able to discover HMF FlatSeal, its range of flat gasket materials for effective static sealing in low and high temperature applications.

Trelleborg Sealing Solutions will be at booth N0880.

Micron's memory and Samsung hynix is also a well-known memory brand in the circle, whether it is the consumer market or a more professional field, Micron is also involved in other brands, if as an ordinary consumer, Micron memory is likely to hear because many desktops and notebooks have a large number of types of personal computers are used by Micron.

MTA18ASF4G72PDZ-3G2E1 is a memory module product designed for the professional and stable requirements of the server or workstation, the fourth generation DDR 3200 frequency RDIMM, in fact, the hardware parameters and other brands of the same type of memory module are not bad, the main performance of the memory module still needs to look at the memory particles, and magnesium light is capable of producing memory particles by itself, and assembled as a memory module, so its industrialization is more comprehensive, the quality is also very guaranteed.

MTA18ASF4G72PDZ-3G2E1 product detailed parameters:

News on September 12, according to Taiwan media reports, Toshiba Electronic Devices & Storage, a subsidiary of Toshiba Semiconductor, announced on the 12th that its semiconductor production base in Iwate Prefecture stopped work on the 11th, mainly due to a power outage during the inspection of power facilities on the 11th.

According to public information, the Iwate Plant of Toshiba Group Corporation was the Iwate Plant of Toshiba Group Corporation, which mainly produces general-purpose MCUs and other products used in in-vehicle equipment and people's livelihood products. It is worth noting that the sudden power outage did not cause damage to the production equipment of the Iwate Works, but in order to ensure the normal operation of the equipment, the full resumption of work is planned for September 17.

As for the loss, the report pointed out that during the power outage, all semi-finished products in progress on the production line were scrapped, so it is expected that shipments to customers will be affected.

It is understood that consumer demand was weak in the first half of this year, affected by this, downstream orders were continuously cut, and the signing with upstream fabs was often "irrevocable orders", making the inventory backlog of MCU manufacturers more and more serious, and had to sell products at low prices.

Recently, Texas Instruments, a well-known global analog chip company, released a Bluetooth MCU priced at only $0.79, which is very outstanding in terms of function and performance, but its price is only $0.79. MCUs have also become another key chip facing significant price cuts after driver ICs, some power management ICs and CIS image sensors.

Although the MCU market is depressed, according to IC Insights, the global market space for automotive MCU products in 2021 will be $7.6 billion, a year-on-year increase of 22.58%. IC Insights predicts that the global automotive MCU product market size will maintain a compound growth rate of 7.7% from 2022 to 2026, and its market size will reach $11 billion by 2026. Overall, the prospects of automotive MCUs are still clear.