Total: 576
TI
ON
Microchip
ST
Infineon
ADI
NXP
-
Surface mount
Through-Hole
Surface mount,Wettable wings
bulk
pallet
TR
TR,CT
pipe
Automotive, AEC-Q100
Functional Safety (FuSa)
flexPWR™
G.fast
RapidCharge Anywhere™
Automotive, AEC-Q100, Functional Safety (FuSa)
BD870
On sale
3.3V
5V
12V
1.8V
3V ~ 3.6V
4.5V ~ 5.5V
1.14V ~ 1.26V
3.135V ~ 3.465V
2.25V ~ 2.75V
1.8V ~ 3.6V
2.7V ~ 5.5V
3V ~ 5.5V
3.3V,5V
1.8V,3.3V
1.6V ~ 3.6V
5V ~ 28V
2.375V ~ 2.625V
4.75V ~ 5.25V
2.5V,3.3V
1.62V ~ 1.98V
1.8V ~ 3.3V
3.14V ~ 3.47V
5V ~ 27V
6V ~ 18V
3V ~ 4.5V
6V ~ 27V
1.25V
1.6V ~ 2V,3V ~ 3.6V
4V ~ 5.25V
5.5V ~ 30V
1.8V,2.5V,3.3V
1.71V ~ 1.89V,2.375V ~ 2.75V,3.135V ~ 3.63V
1.71V ~ 1.89V,2.375V ~ 2.625V,3.135V ~ 3.465V
1.2V,1.8V,2.5V
5V ~ 40V
4.55V ~ 28V
4V ~ 4.5V
Receive device
Driver
Sending and receiving device
0°C ~ 70°C
0°C ~ 85°C
-40°C ~ 85°C
-40°C ~ 105°C
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
0°C ~ 70°C(TA)
-40°C ~ 125°C(TA)
-40°C ~ 125°C
-40°C ~ 150°C(TA)
-40°C ~ 150°C(TJ)
-40°C ~ 150°C
-45°C ~ 85°C
8-SOIC(0.154,3.90mm wide)
8-VDFN Exposed Pad
25-UFBGA,WLCSP
48-LQFP
64-LQFP
16-SOIC(0.154,3.90mm wide)
14-TSSOP(0.173,4.40mm wide)
36-VFQFN Exposed Pad
100-TFBGA
32-VFQFN Exposed Pad
48-VFQFN Exposed Pad
20-VQFN Exposed Pad
8-DIP(0.300,7.62mm)
8-VFDFN Exposed Pad
14-SOIC(0.154,3.90mm wide)
28-SSOP(0.209,5.30mm wide)
8-TSSOP,8-MSOP(0.118,3.00mm wide)
28-VQFN Exposed Pad
14-DIP(0.300,7.62mm)
48-TQFP
64-VFQFN Exposed Pad
16-VQFN Exposed Pad
24-VFQFN Exposed Pad
48-BSSOP(0.295,7.50mm wide)
56-VFQFN Exposed Pad
8-WFDFN Exposed Pad
24-VQFN Exposed Pad
25-WFBGA
24-VFQFN Exposed Pad,24-MLF®
10-VFQFN Exposed Pad,10-MLF®
16-VQFN Exposed Pad,16-MLF®
32-VFQFN Exposed Pad,32-MLF®
14-VDFN Exposed Pad
72-VFQFN Exposed Pad
16-VDFN Bare pad
16-QFN
25-VFBGA
25-WLCSP
64-LQFP Exposed Pad
128-BFQFP
14-VFQFN Exposed Pad,14-MLF®
40-VFBGA
25-UFBGA
117-LBGA
260-BGA