Total: 208
TI
ON
Microchip
ST
Infineon
ADI
NXP
-
Surface mount
Through-Hole
Surface mount,Wettable wings
bulk
pallet
TR
TR,CT
CT
pipe
TR,CT,bulk
TR,bulk
belt
Automotive, AEC-Q100
FlexRay™
flexPWR™
G.fast
RapidCharge Anywhere™
On sale
Final sale
stop production
Not applicable to new design
Receive device
Driver
Sending and receiving device
route Driver,IR device
0°C ~ 70°C
-40°C ~ 85°C
-40°C ~ 105°C
-40°C ~ 125°C(TA)
-40°C ~ 125°C
-40°C ~ 150°C(TJ)
-40°C ~ 150°C
0°C ~ 125°C
mould
8-SOIC(0.154,3.90mm wide)
8-VDFN Exposed Pad
25-UFBGA,WLCSP
20-TSSOP(0.173,4.40mm wide)
20-SOIC(0.295,7.50mm wide)
40-VFQFN Exposed Pad
16-DIP(0.300,7.62mm)
32-VFQFN Exposed Pad
28-TSSOP(0.173,4.40mm wide)
14-SOIC(0.154,3.90mm wide)
28-SSOP(0.209,5.30mm wide)
44-VQFN Exposed Pad
24-VFQFN Exposed Pad
16-TSSOP(0.173,4.40mm wide)
24-WFQFN Exposed Pad
36-BFSOP(0.295,7.50mm wide)Exposed Pad
20-SOIC(0.209,5.30mm wide)
SOT-23-8
20-WFQFN Exposed Pad,CSP
20-SSOP(0.154,3.90mm wide)
SOT-23-14 Thin, SOT-23 variant
14-VDFN Exposed Pad
8-PowerTDFN
20-VFQFN Exposed Pad,CSP
24-TFSOP(0.173,4.40mm wide)
32-QFN Exposed Pad
138-VQFN Exposed Pad
16-QFN
25-VFBGA
25-WLCSP
25-UFBGA
8-TDFN Exposed Pad
14-TDFN Exposed Pad
336-LFBGA,CSBGA
40-DIP module
196-LBGA,FCCSPBGA
144-BBGA,FCBGA