Total: 118
TI
ON
Microchip
ST
Infineon
ADI
NXP
Surface mount
Through-Hole
Surface mount,Wettable wings
bulk
pallet
TR
TR,CT
pipe
TR,CT,bulk
TR,bulk
belt
Automotive, AEC-Q100
µModule®
B100
iCoupler®
ADM2561E
AISG®
On sale
Final sale
stop production
Not applicable to new design
-
3.3V
1.7V ~ 3.6V
3V ~ 3.6V
4.5V ~ 5.5V
1.65V ~ 3.6V
3V ~ 5.5V
4.75V ~ 5.25V
3.15V ~ 3.45V
3.13V ~ 3.47V
5V ~ 18V
8.5V ~ 15V
3V ~ 3.6V,4.5V ~ 5.5V
1.8V,2.5V,3.3V
9V ~ 36V
4.5V ~ 24V
0.5V ~ 6V
1.71V ~ 5.5V
Receive device
Driver
Sending and receiving device
Transceiver device, isolated
-40°C ~ 105°C
8-SOIC(0.154,3.90mm wide)
8-VDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
48-LQFP
20-SOIC(0.295,7.50mm wide)
40-VFQFN Exposed Pad
16-DIP(0.300,7.62mm)
16-SOIC(0.154,3.90mm wide)
32-VFQFN Exposed Pad
48-VFQFN Exposed Pad
80-TQFP Exposed Pad
8-DIP(0.300,7.62mm)
14-SOIC(0.154,3.90mm wide)
20-VFQFN Exposed Pad
10-VFDFN Exposed Pad
8-TSSOP,8-MSOP(0.118,3.00mm wide)
16-VFQFN Exposed Pad
40-WFQFN Exposed Pad
32-VFQFN Exposed Pad,CSP
24-WFQFN Exposed Pad
10-WFDFN Exposed Pad
24-VFQFN Exposed Pad,24-MLF®
44-BFLGA
32-BBGA
28-BSSOP(0.295,7.50mm wide)