Total: 610
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk
pallet
TR
box
TR,CT
CT
pipe
bulk,pallet
pallet,pallet
bulk,pallet,pallet
256Mb(32M x 8)
256Mb(64M x 4)
512Mb(64M x 8)
512Mb(128M x 4)
1Gb(128M x 8)
2Gb(256M x 8)
1Mb(128K x 8)
2Mb(256K x 8)
2Mb(256K x 8,128K x 16)
4Mb(512K x 8)
4Mb(512K x 8,256K x 16)
8Mb(1M x 8)
8Mb(1M x 8,512K x 16)
16Mb(2M x 8)
16Mb(2M x 8,1M x 16)
32Mb(4M x 8)
32Mb(4M x 8,2M x 16)
128Mb(16M x 8)
128Mb(16M x 8,8M x 16)
128Mb(32M x 4)
256Mb(32M x 8,16M x 16)
16Mb(512K x 32)
32Mb(1M x 32)
32Mb(8M x 4)
64Mb(16M x 4)
64Mb(8M x 8)
64Mb(8M x 8,4M x 16)
2Mb(256k x 8)
4Mb(512k x 8)
-
1.7V ~ 1.95V
2.5V ~ 3.6V
2.7V ~ 3.6V
1.7V ~ 2V
2.3V ~ 3.6V
3V ~ 3.6V
4.5V ~ 5.5V
2.5V ~ 3.3V
1.65V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
1.65V ~ 2V
2.65V ~ 3.6V
1.65V ~ 1.95V
1.65V ~ 2.75V
-40°C ~ 125°C(TA)
120 MHz
200 MHz
100 MHz
166 MHz
40 MHz
50 MHz
75 MHz
108 MHz
133 MHz
66 MHz
80 MHz
104 MHz
56 MHz
70ns
80ns
1.8ms
8ms,2.8ms
8ms,5ms
15ms,5ms
45ns
55ns
3ms
15ms,3ms
8-SOIC(0.154 ,3.90mm wide)
24-TBGA,CSPBGA
5ms
30µs,800µs
60µs,5ms
63-TFBGA
24-TBGA
48-TFSOP(0.724,18.40mm wide)
mould
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
44-SOIC(0.496,12.60mm wide)
48-TFBGA
56-TFSOP(0.724,18.40mm wide)
64-LBGA
64-TBGA
8-UDFN Exposed Pad
8-UFDFN Exposed Pad
48-VFBGA
80-BQFP
80-LBGA
8-XFDFN Exposed Pad
8-XDFN Exposed Pad
8-WFDFN Exposed Pad
24-VBGA
8-WSON(5x6)
80-PQFP(14x20)
8-WLGA
0404