Total: 8
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
TR,CT
8Mb(1M x 8)
16Mb(2M x 8)
512Kb(64K x 8)
4Mb(512k x 8)
2.7V ~ 3.6V
1.65V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
1.65V ~ 2V
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
108 MHz
133 MHz
33 MHz
80 MHz
104 MHz
3ms
8-XFBGA,WLCSP
800µs
30µs,800µs