Total: 22
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
256Mb(16M x 16)
2.7V ~ 3.6V
1.7V ~ 2V
-40°C ~ 85°C(TA)
-30°C ~ 85°C(TA)
52 MHz
66 MHz
70ns
56-TFSOP(0.724,18.40mm wide)
64-TBGA
79-VFBGA
88-TFBGA