Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
TR,CT
pipe
16Mb(4M x 4)
1.7V ~ 2V
-40°C ~ 85°C(TA)
108 MHz
8ms,1ms
8-SOIC(0.154,3.90mm wide)
8-XFBGA,CSPBGA